TOKYO–(BUSINESS WIRE)–ERS digital, the innovation chief in thermal administration options for the semiconductor business, is slated to current at this yr’s digital SEMICON Japan. The presentation might be held by ERS’ key leaders Laurent Giai-Miniet and Klemens Reitinger. Along with wanting again on the firm’s 50 yr lengthy historical past, the co-CEOs will give a complete overview of the corporate’s newest thermal applied sciences for wafer probing. The viewers might be given a better have a look at a few of ERS’ most exceptional capabilities, together with temperature accuracy right down to 50mK, thermal uniformity right down to 0.1°C, and Extremely-Low Noise measurements on the femto-Ampere degree. Viewing the presentation requires pre-registration, which might be finished on SEMICON Japan’s website.
“It’s been 50 years since my uncle, Erich Reitinger, invented the primary thermal chuck for wafer probing, so we wished to take this chance to point out our viewers how far we’ve come since then”, CTO Klemens Reitinger. “Having the ability to do that at SEMICON Japan is especially vital to us, since we’ve been attending this occasion for greater than 20 years.”
“There are well-established gear producers in Japan, however we see an growing demand for superior thermal options related to the rise of latest functions in electromobility, autonomous driving, synthetic intelligence (AI), 5G and the Web of Issues,” says CSMO Laurent Giai-Miniet. “That is the place ERS comes into the image, by offering specialised, customizable options that may sort out these thermal challenges.”
The corporate may even be exhibiting just about along with its Japanese distribution associate, ONC Inc., who’s offering gross sales and help companies from its headquarters in Tokyo. The exhibition goes reside on December 14th and closes on December 17th.
ERS digital GmbH, primarily based round Munich, has been producing revolutionary thermal check options for the business for almost 50 years. The corporate has gained an impressive repute within the sector, notably with its quick and correct air cool-based thermal chuck programs for check temperatures starting from -65°C to +550°C for analytical, parameter-related and manufacturing exams. Right now, thermal chuck programs developed by ERS akin to AC3, AirCool® PRIME, AirCool® and PowerSense® are integral parts in all larger-sized wafer probers throughout the semiconductor business.
For extra data, please go to: www.ers-gmbh.com