TIANSHUI, China–(BUSINESS WIRE)–ERS digital, the innovation chief in thermal administration options for the semiconductor business, is exhibiting and presenting at CSPT (China Semiconductor Packaging and Check Market & Expertise Annual Convention) for the primary time. The convention, which takes place from 8th to 10th November in Tianshui, might be attended by a number of the main gamers within the semiconductor manufacturing business, together with ASE Group, JCET Group and TongFu Microelectronics Co., Ltd. (TFME).
In 2008, ERS launched the primary ever thermal debonding and warpage correction device for Fan-out Superior Packaging purposes, leveraging its a long time of expertise in temperature wafer probing. Since then, the corporate has continued to drive innovation within the Fan-out house, by supporting totally different wafer format and panels.
Two years in the past, ERS introduced the MPDM700, a guide thermal debonding machine for panels as much as 650mm x 550mm, which enabled additional analysis and improvement of Superior Packaging applied sciences. The machine eliminates any handling-induced warpage throughout debond, and may also scale back general warpage right down to 4mm due to ERS’ patented TriTemp® slide. An automated model of the machine, referred to as APDM700, is at present in improvement with a Chinese language lead buyer. Joshua Zhou, Gross sales and Advertising and marketing Director of ERS Better China, will reveal some key options of the machine’s structure and ERS’ expertise throughout his CSPT presentation, earlier than its anticipated launch early subsequent 12 months.
“CSPT has a profound influence on the Chinese language semiconductor business and supplies a useful alternative for us to be taught extra concerning the rising Superior Packaging market in China”, says Debbie-Claire Sanchez, Fan-out Tools Enterprise Unit Supervisor of ERS.
“We’re wanting ahead to interacting with our business friends and share our newest improvements within the Fan-out house with them”, says Joshua Zhou.
”It’s an honour to have ERS digital GmbH – a good German semiconductor firm with greater than 10 years of expertise in Superior Packaging Tools – to affix the CSPT this 12 months”, says Shi Yueru, Advertising and marketing Director for CSPT. “We’re excited to supply the attendees the chance to be taught extra about ERS’ state-of-the-art expertise, which may also help drive the event of the Chinese language semiconductor business.”
ERS digital GmbH, primarily based round Munich, has been producing modern thermal take a look at options for the business for practically 50 years. The corporate has gained an impressive repute within the sector, notably with its quick and correct air cool-based thermal chuck methods for take a look at temperatures starting from -65°C to +550°C for analytical, parameter-related and manufacturing exams. At the moment, thermal chuck methods developed by ERS resembling AC3, AirCool® PRIME, AirCool® and PowerSense® are integral parts in all larger-sized wafer probers throughout the semiconductor business.
For extra data, please go to: www.ers-gmbh.com