The Korea Institute of Industrial Expertise introduced on Dec. 16 that it has developed an authentic epoxy resin manufacturing know-how and produced an epoxy molding compound higher in thermal growth than Japanese merchandise by utilizing the know-how.
The compound is an natural materials utilized in back-end processing within the semiconductor business and the worldwide market dimension is estimated at 1.5 trillion gained. Though South Korea’s dependence on the compound imported from Japan is at present as excessive as 87 p.c, the newly developed know-how is anticipated to drop the share in packaging, the ultimate technique of semiconductor manufacturing.
The institute designed and synthesized a structurally novel epoxy resin by itself and decreased the diploma of thermal growth to the bottom stage on the planet. These imported from Japan are characterised by being a lot larger in thermal growth coefficient than semiconductor chips and this has usually led to bending of your complete element within the packaging course of.
Epoxy materials producers have tried to resolve the issue by reducing the coefficient with a rise in silica content material. This, nevertheless, has resulted in an extreme improve in viscosity and a lower within the ease of processing.
The know-how developed by the institute is characterised by sustaining the benefit and but reducing the coefficient to roughly 3 ppm/°C, near that of a semiconductor chip, merely via a change within the construction of epoxy resin itself. As well as, the epoxy molding compound of the institute allows large-area packaging of 12 inches or extra in contrast to these from Japan, which implies it may be extensively utilized in relation to self-driving autos, synthetic intelligence gadgets, and many others.